Dry apply protective methods

ABSTRACT

A system for protecting a surface of a substrate includes a protective film, which is configured to be applied and secured to the surface, as well as a backing on an adherent surface of the protective film and an application tape over an exterior surface of the protective film. Protruding features, such as tabs, adjacent to different peripheral edges of the protective film may enable removal of the backing and the application tape from the protective film, and may include features that indicate the order in which each protruding feature is to be grasped to peel its corresponding element away from the protective film. Methods of using such a system are also disclosed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/724,172, filed Oct. 3, 2017 and titled DRY APPLY PROTECTIVE METHODS(“the '172 application”), issued as U.S. Pat. No. 10,364,374 on Jul. 30,2019. The '172 application is a continuation of U.S. patent applicationSer. No. 13/865,175, filed on Apr. 17, 2013 and titled DRY APPLYPROTECTIVE SYSTEMS AND METHODS (“the '175 application”), issued as U.S.Pat. No. 9,777,195 on Oct. 3, 2017. In the '175 application, a claim forthe benefit of priority was made, under 35 U.S.C. § 119(e), to the Apr.17, 2012 filing date of U.S. Provisional Patent Application No.61/625,550, titled DRY APPLY PROTECTIVE SYSTEMS AND METHODS (“the '550Provisional Application”). The '175 application is also acontinuation-in-part of U.S. patent application Ser. No. 13/166,745,titled PROTECTIVE FILMS FOR DRY APPLICATION TO PROTECTED SURFACES,INSTALLATION ASSEMBLIES AND KITS INCLUDING THE FILMS, DEVICES PROTECTEDWITH THE FILMS, AND ASSOCIATED METHODS, filed on Jun. 22, 2011 (“the'745 application”), in which claims for the benefit of priority to U.S.Provisional Patent Application 61/357,972, titled PROTECTIVE FILMS FORDRY APPLICATION TO PROTECTED SURFACES, INSTALLATION ASSEMBLIES AND KITSINCLUDING THE FILMS, DEVICES PROTECTED WITH THE FILMS, AND ASSOCIATEDMETHODS and filed on Jun. 23, 2010 (“the '972 Provisional Application”)and to U.S. Provisional Patent Application 61/357,427, titled PROTECTIVEFILMS FOR DRY APPLICATION TO PROTECTED SURFACES, INSTALLATION ASSEMBLIESAND KITS INCLUDING THE FILMS, DEVICES PROTECTED WITH THE FILMS, ANDASSOCIATED METHODS and filed on Jun. 22, 2010 (“the '427 ProvisionalApplication”) were made under 35 U.S.C. § 119(e). The entire disclosuresof the '172 application, the '427 Provisional Application, the '972Provisional Application, the '745 application, the '550 ProvisionalApplication, and the '175 application are, by this reference,incorporated herein.

TECHNICAL FIELD

This disclosure relates generally to systems and films for protectingsurfaces of various substrates, including portable electronic devices.More specifically, this disclosure relates to protective systems andprotective films that may be applied to a surface to be protectedwithout the presence of visible air bubbles between the film and thesurface and without the use of a solution to eliminate the presence ofvisible air bubbles. In addition, this disclosure relates to methods forprotecting the surfaces of substrates, such as portable electronicdevices.

BACKGROUND OF RELATED ART

A variety of protective films have been developed to providesubstantially bubble-free protection for the surfaces of electronicdevices without requiring the use of solutions to eliminate the airbubbles. Conventionally, these so-called “dry apply” protective filmshave suffered from a number of deficiencies. For example, it has beendifficult to align them with the surface they are intended to protect.It is also difficult, and sometimes impossible, to remove visible airbubbles from between a conventional dry apply protective film and asurface to which it has been applied.

The construction of many conventional dry apply protective systems isquite simple: a protective film with an adherent surface and a backing.Often, the protective film is relatively rigid, which enables theremoval of air bubbles from between the protective film and a protectedsurface with relative ease. Unfortunately, the rigidity of such aprotective film also renders it prone to delamination from the protectedsurface. The backing protects the adherent surface until the dry applyprotective film is applied to a surface to be protected.

The adherent surface of the protective film may be configured toelectrostatically, or statically, adhere to a surface to be protected.While a statically adherent protective film may be readily removed fromand repositioned upon a surface to be protected, it will lose itsability to adhere with repeated removal and repositioning. Staticallyadherent protective films also easily peel away from the surfaces theyare intended to protect, leaving the surfaces with unsightly appearancesand providing less-than-desirable protection.

Alternatively, the adherent surface may be coated with an adhesivematerial for securing the protective film to the surface to beprotected. While an adhesive coating provides for stronger, morepermanent adhesion of a protective film to a protected surface, theadhesive material suffers from a number of its own deficiencies. Oncethe backing of a conventional dry apply protective system is removedfrom the adherent surface, the adherent surface and any adhesive thereonis exposed and susceptible to contaminants, such as those present on thefingers and/or thumb of an individual who is attempting to apply theprotective film to the surface to be protected. Typically, when theadherent surface of a protective film comes into contact withcontaminants (e.g., oil, dirt, etc., from an individual's fingers and/orthumb; dust; etc.), the contaminants stick to the adherent surface. Whenthe protective film is transparent, any contaminants on the adherentsurface are trapped between the protective film and the protectedsurface, which may leave the protected device with an unsightlyappearance.

SUMMARY

In various aspects, dry apply protective systems and dry applytechniques for securing protective films to surfaces that are to beprotected are disclosed. Such a system and/or technique may be used tosecure a protective film to a surface of a substrate that may benefit,aesthetically or otherwise, from protection (e.g., a surface of anelectronic device, a crystal of a watch, etc.). In some embodiments, aprotective film may be applied to a surface without diminishing theaesthetics of the surface.

A dry apply protective system and/or technique may be configured toapply a protective film to one or more surfaces of a substrate (e.g., anelectronic device, etc.), such as a surface through which information orimages are visible (e.g., the surface of a monitor, or screen, thatdisplays information or images, etc.). When configured for use over asurface through which information or images are to be viewed (e.g., overa monitor, or screen, of an electronic device, etc.), a protective filmmay be transparent. Protective films that are configured for applicationto other surfaces, including surfaces through which information orimages need not be viewed, may be transparent, translucent, or opaque,and may, in various embodiments, include one or more decorative featuresthat enhance the look of a surface of a device to which they are to beapplied.

A dry apply protective system according to this disclosure, in variousembodiments, includes a protective film. The protective film comprises apolymer layer that may ultimately protect the surface of a substrate,and includes an adherent surface and an opposite, exterior surface. Theadherent surface may carry an adhesive material, such as a pressuresensitive adhesive material, which may facilitate adhesion, or securing,of the protective film to a surface to be protected. When the protectivefilm is assembled with other elements of the dry apply protectivesystem, a backing may be secured to the adhesive material on theadherent surface, while an application layer, or an application tape,may be secured to the exterior surface of the protective film. In someembodiments, a dry apply protective system may also include a releaselayer between the application tape and the protective film.

The application tape may be fully superimposed over the protective film.The application tape may comprise a substantially transparent element.In some embodiments, the application tape may bear indicia. The indiciaon the application tape may facilitate alignment of the application tapeand, thus, of the protective film over a surface of a substrate. Inaddition or as an alternative to facilitating alignment, the indicia onthe application tape may also provide basic instructions on applying theprotective film to the surface of the substrate. These indicia may becarried by (e.g., printed on, etc.) either an exterior surface of theapplication tape, or its opposite, adherent surface.

The application tape may have substantially the same lateral dimensionsas the protective film. Alternatively, at least one dimension (e.g.,length, width, etc.) of the application tape may exceed thecorresponding dimensions of the application tape and the protectivefilm. Thus, a portion of the application tape, which is referred toherein as a “peripheral region,” may extend laterally beyondcorresponding edges of the application tape and the protective film.Each peripheral region of the application tape that is located laterallybeyond a corresponding edge of the protective film may be superimposedwith a corresponding portion of the backing. In some embodiments, theperipheral region may be configured to surround the outer periphery ofthe protective film and, thus, to be located laterally beyond the entireouter periphery of the protective film.

The exterior surface of the application tape, against which a securingelement (e.g., a squeegee, a card, a finger, etc.) may be pressed andacross which the securing element may be translated to secure theprotective film to a surface to be protected, may be configured toenable the securing element to be translated thereacross in a smooth,continuous fashion. In some embodiments, the exterior surface of theapplication tape may be lightly textured or microtextured. The texturingof the exterior surface may minimize friction generated as the securingelement is pressed against and translated across the exterior surface ofthe application tape.

An adhesive material on the adherent surface of the protective film maysecure the adherent surface to the backing. Pressure-sensitive adhesiveson an adherent surface of the application tape may similarly secure theadherent surface of the application tape and, thus, the application tapeto the exterior surface of the protective film, or to a release layerpositioned over the protective film. In addition, pressure-sensitiveadhesives on portions of the adherent surface of the application tapethat extend laterally beyond the protective film may secure thoseportions of the application tape to the backing.

The adhesive material on the adherent surfaces of the protective filmand the application tape may be configured to remain on its respectiveadherent surface while leaving little or no adhesive residue on asurface to which the application tape or protective film was previouslysecured. Thus, adhesive material on the adherent surface of theapplication tape may be removed from the exterior surface of theapplication tape with little or no adhesive residue remaining on theexterior surface of the application tape. The application tape may besimilarly removed from the exterior surface of protective film withoutleaving substantially any adhesive residue on the exterior surface ofthe protective film, but with adhesive material remaining on theadherent surface of the application tape. Adhesive material on theadherent surface of the protective film may likewise remain on theadherent surface as the protective film is peeled away from the backingor the surface of a substrate, with substantially no adhesive residueremaining on the backing or the surface of the substrate. Such selectiveadhesion may be accomplished in a variety of ways, including, but notlimited to, selecting appropriate adhesive materials, configuring theadherent surfaces of the protective film, the application tape, and theapplication tape to retain the adhesive material (e.g., with surfaceroughness or other characteristics, etc.) better than the surfaces towhich these elements will be applied, the process(es) by which theadhesive materials are applied to their respective adherent surfaces, orin any other suitable manner.

A release layer may be configured to be located over at least a portionof the protective film, to remain on the application tape as theapplication tape is pulled away from the protective film and, thus, toprevent the application tape from pulling the protective film away froma surface to be protected, or at least reduce the force with which theapplication tape may pull the protective film away from the surface of asubstrate.

The backing may be configured to be substantially superimposed with theapplication tape. One or both of the backing and the application tapemay include a feature (e.g., a tab, etc.) that protrudes beyond an outerperiphery of the other the application tape and the backing. On thebacking, such a feature may facilitate removal of the backing from theapplication tape and from the protective film. Such a protruding featuremay lack adhesive material, enabling it to be used to position theprotective film without sticking to an individual's fingers.

In some embodiments, the backing may be transparent, or at leasttranslucent enough to enable an individual to view the surface to beprotected as the dry apply protective system (including the protectivefilm and, optionally, the application tape) is positioned thereover andsecured thereto. The use of a transparent or even a translucent backingenables proper alignment of the protective film over the surface to beprotected, even when the majority of the backing (e.g., the adhesionsection thereof, etc.) remains in place over the adherent surface of theprotective film; for example, while initially securing a small area ofthe adherent surface of the protective film to the surface to beprotected.

In some embodiments, the backing may comprise a single element that isconfigured to be substantially superimposed with the application tape.In other embodiments, the backing may include two or more discretesections, such as an alignment section and an adhesion section. Analignment section of the backing may be configured to cover a relativelysmall area of the adherent surface of the protective film. Thus, as thealignment section is removed from the adherent surface, a relativelysmall portion of the adherent surface, and any adhesive materialthereon, are exposed, while the adhesion section of the backingcontinues to cover a much larger portion of the adherent layer. Thisconfiguration enables an initial securement of the protective film to asurface to be protected, as well as the ready removal of protective filmfrom that surface if realignment of the protective film is desired. Insome embodiments, the alignment section may comprise an elongate striplocated adjacent to an edge of the protective film. Once initialsecurement is complete, the adhesion section of the backing may beremoved from the adherent surface and the remainder of the protectivefilm may be secured to the surface that is to be protected.

The backing may be relatively rigid when compared with the protectivefilm and the application tape. The relative rigidity of the backing, thematerial(s) from which the backing is formed, or other characteristicsmay enable the backing to be readily separated and removed from theadherent surface of the application tape. Additionally, in embodimentswhere the backing is separated into an alignment section and an adhesionsection, once the alignment section has been removed and the protectivefilm has been initially secured to a surface to be protected, therelative rigidity of the adhesion section of the backing may enable itsgradual removal as the protective film is gradually secured to thesurface to be protected. In some embodiments, the relative rigidity ofthe adhesion section of the backing may enable it to be graduallyremoved without manipulation (e.g., holding, pulling, etc.) as apressure front (e.g., that generated with a securing element, such as asqueegee, a card, a finger, etc.) is drawn across the protective film togradually secure it to the protected surface. The relative rigidity ofthe backing and flexibility of the protective film (i.e., the backing ismore rigid and less flexible than the protective film) may also minimizeany exposure of the adherent layer (e.g., a thin, elongate section,etc.) during the application of the protective film to the surface to beprotected, which may prevent or minimize the presence of air bubbles(including visible air bubbles) between the protective film and theprotected surface, as well as contamination of the adherent surface.

The protective film of a dry apply protective system according to thisdisclosure and, optionally, the backing and or application tape of sucha protective system may include one or more cutouts or other featuresthat are configured to accommodate various features on or adjacent tothe periphery of the surface that is to be protected by the protectivefilm. In addition, these cutouts or other features may facilitate properalignment of the protective film with the surface the protective film isintended to protect.

In another aspect, various application methods, which should be apparentfrom the preceding disclosure, are disclosed. An application method mayinclude removal of the alignment portion of a backing from an adherentsurface of a protective film. With a portion of the adherent surfaceexposed, the protective film may be aligned with and partially securedto surface to be protected. Thereafter, a pressure front may begenerated and translated (e.g., with a securing element, etc.) from overa region of the protective film that has been already been secured tothe surface that is to be protected toward an adjacent portion of theprotective film that has not yet been secured to the surface to beprotected. In some embodiments, as the pressure front is translatedacross the protective film, an adhesion section of the backing mayseparate from the adherent surface of the protective film and anyadhesive material on the adherent surface. In embodiments where anapplication tape covers an exterior surface of the protective film, theapplication tape may be removed from the exterior surface of theprotective film once the protective film has been secured to the surfacethat is to be protected.

Other aspects, as well as features and advantages of various aspects, ofthe subject matter disclosed herein will become apparent to those ofordinary skill in the art through consideration of the ensuingdescription, the accompanying drawings, and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings:

FIG. 1 is a top view of an embodiment of a protective film configuredfor dry application to a surface of a substrate (e.g., an electronicdevice, etc.);

FIG. 2 is a side view of the embodiment of protective film of FIG. 1;

FIG. 3 provides a top view of an embodiment of a dry apply protectivesystem, or an installation assembly, that includes a protective film ofthe type shown in FIGS. 1 and 2, as well as a release layer, anapplication tape and a backing;

FIG. 4 is a bottom view of the embodiment of dry apply protective systemshown in FIG. 3;

FIGS. 5 and 5A are, respectively, a side view and an enlarged, partialside view of the embodiment of dry apply protective system illustratedby FIGS. 3 and 4;

FIG. 6 shows the dry apply protective system of FIGS. 3-5 from which thebacking has been partially removed;

FIG. 7 is a side view of another embodiment of dry apply protectivesystem;

FIGS. 8-12 illustrate an embodiment of a process for manufacturing anembodiment of dry apply protective system, such as that shown in FIGS.3-6;

FIGS. 13-18 depict embodiments of methods for installing a protectivefilm on a surface of a substrate (e.g., an electronic device, etc.)using an embodiment of dry apply protective system such as that shown inFIGS. 3-6;

FIG. 19 shows an embodiment of a substrate (e.g., an electronic device,etc.) including a dry-apply protective film on at least one surfacethereof.

FIG. 20 is a top view of another embodiment of a dry apply protectivesystem;

FIG. 21 is a side view of the embodiment of dry apply protective systemshown in FIG. 20;

FIGS. 22-24 depict an embodiment of a technique for using the dry applyprotective system of FIGS. 20 and 21 to apply a protective film to asurface of a substrate;

FIG. 25 is a perspective view of yet another embodiment of a dry applyprotective system;

FIG. 26 is a top view of the embodiment of dry apply protective systemshown in FIG. 25;

FIG. 27 is a bottom view of the embodiment of dry apply protectivesystem illustrated by FIG. 25;

FIG. 28 is a cross-sectional representation of the dry apply protectivesystem of FIG. 25;

FIG. 29 shows removal of an alignment section of a backing from anadherent surface of a protective film of the embodiment of dry applyprotective system shown in FIG. 25;

FIG. 30 illustrates an embodiment of alignment and initial securing ofthe protective film to a surface that is to be protected;

FIGS. 31 and 32 depict the application of a pressure front across theprotective film to secure the same to the surface to be protected,including the simultaneous removal of an adhesion section of the backingfrom the adherent surface of the protective film; and

FIG. 33 illustrates removal of the application tape from an exteriorsurface of the protective film.

DETAILED DESCRIPTION

FIGS. 1 and 2 illustrate an embodiment of a dry apply protective film30. The dry apply protective film 30 is also referred to herein as a“protective film” for the sake of simplicity. The protective film 30includes a substantially planar member with an exterior surface 32 andan opposite adherent surface 34, which is configured to be secured to asurface of a substrate (e.g., an electronic device, etc.). The adherentsurface 34 carries an adhesive material 36, which enables the protectivefilm 30 to be secured to the surface of the substrate by a so-called“dry-apply” process, which does not require the use of any “wet”chemicals.

The protective film 30 may be transparent, translucent, or opaque. Theexterior surface 32 of the protective film 30 may be configured with afinish that appears (to the so-called “naked eye”, without imageenhancement, etc.) to be smooth (e.g., glossy, etc.), to have a mattefinish, or to have any other desired texture. The exterior surface 32 ofthe protective film 30 may include features that provide privacy (e.g.,only allow images to be viewed through the protective film 30 within anarrow range of angles around 90°, etc.). The exterior surface 32 may bereflective when viewed at certain angles. In some embodiments, theprotective film 30 may include decorative features.

In some embodiments, the protective film 30 may include one or morelayers. The material and thickness of each layer may be tailored toimpart the protective film 30 with desired characteristics, orproperties, as understood by those of skill in the art.

A variety of materials may be used to form the protective film 30. In aspecific embodiment, the protective film 30 may comprise a polyurethane.A number of polyurethanes may provide desirable protective properties.In embodiments where the protective film 30 is transparent, some ofthese polyurethanes may also impart the protective film 30 withdesirable optical properties (e.g., a clarity through which informationor images may be viewed with little or no visible (to the naked eye,without image enhancement, etc.) distortion, etc.). For the sake ofsimplicity, the term “polyurethane,” as used herein, includes polymersthat include urethane, or “carbamate,” linkages. A polyurethane may alsoinclude urea linkages, as well as combinations of urethane and urealinkages (e.g., poly(urethane-urea)s, etc.). Some polyurethanes that areuseful for forming the protective film 30 include backbones in which atleast about 80% of the linkages are urethane or urea linkages.

Examples of commercially available polyurethanes that may be used toform the protective film 30 include, but are not limited to, thosemarketed under the trade names KRYSTALFLEX® by Huntsman Corporation ofAuburn Hills, Mich.; DURAFLEX® and TEXIN® (e.g., the aliphaticester-based polyurethane sold as TEXIN® DP7-3008) by BayerMaterialScience, LLC, of Pittsburgh, Pa.; ARGOTHANE™ by Argotec, Inc.,of Greenfield, Mass.; and TECOFLEX® (e.g., CLA-93AV) by LubrizolCorporation of Wickliffe, Ohio; as well as polyurethanes marketed byAmerican Polyfilm, Inc., of Branford, Conn., and by Stevens Urethane ofEasthampton, Mass. (e.g., the extrudable aliphatic polyurethanesdesignated SS-1219-92 and SS-2219-92).

In addition or as an alternative to a polyurethane, a protective film 30may include one or more of a polyvinyl chloride, a polyvinyl acetate, apolypropylene, a polyester, a poly(meth)acrylate, a polyethylene, and arubbery resin (e.g., a silicone elastomer, etc.).

The adhesive material 36 carried by the adherent surface 34 of theprotective film 30 may have any suitable thickness. In some embodiments,the adhesive material 36 may be applied to the adherent surface 34 in afilm that has a thickness of about 5 microns to about 150 microns or,even more specifically, of about 30 microns to about 100 microns.

In embodiments where the protective film 30 is transparent, theexclusion of reactive components from the adhesive material 36 mayimpart the adhesive material 36 with optical clarity and, thus, minimizedistortion of images that may be viewed through the transparentprotective film 30.

The adhesive material 36 may substantially lack non-reacted reactivecomponents, such as monomers. The adhesive material 36 may lackcomponents, such as plasticizers, that may migrate from the adhesivematerial 36 and reduce adhesion of the protective film 30 to a surfacethat is to be protected.

In some embodiments, the adhesive material 36 may comprise apressure-sensitive adhesive. A pressure-sensitive adhesive may beconfigured to semi-permanently secure the adherent surface 34 of theprotective film 30 to a surface to be protected, but be selectivelyremoved from the surface (e.g., when repositioning the protective film30 relative to the surface, when removing a damaged protective film fromthe surface, etc.). In addition, a pressure sensitive adhesive may leavelittle or no residue on the previously protected surface once theprotective film 30 has been removed from, and no longer protects, thatsurface. Examples of pressure-sensitive adhesives that may be used asthe adhesive material 36 include, but are not limited to,(meth)acrylates (e.g., acrylates, methacrylate, etc.), as well asadhesives that include chemistries based on natural and syntheticrubbers, polybutadiene and copolymers thereof, polyisoprene andcopolymers thereof, and silicones (e.g., polydimethylsiloxane,polymethylphenylsiloxane, etc.). In a particular embodiment, theadhesive material 36 may include 2-ethyl hexyl acrylate, vinyl acetate,and polymerized acrylic acid monomers. Such an adhesive material isavailable from entrochem, inc., of Columbus, Ohio, under trade nameENTROCHEM™-ECA 340.

In other embodiments, the adhesive material 36 may include aheat-activated or a pressure-activated adhesive material.

The adhesive material 36 may include one or more additives. Examples ofadditives include, but are not limited to, cross-linking agents (e.g.,aluminum cross-linkers, melamine cross-linkers, etc.).

In some embodiments, the adherent surface 34 and/or any adhesivematerial 36 thereon may include microchannels. In a specific embodiment,the microchannels may impart the adherent surface 34 and/or any adhesivematerial 36 thereon with a repetitive hexagonal pattern. Themicrochannels may enable air to be removed from between the adherentsurface 34 and a surface to which the protective film 30 is secured,while the protective film 30 is secured to that surface and/or after theprotective film 30 has been secured to that surface.

Turning now to FIGS. 3-5A, an embodiment of a dry apply protectivesystem 10, which is also more simply referred to herein as a “system,”is depicted. The system 10 includes a protective film 30, as well as abacking 20, a release layer 40, and an application tape 50. In sequencefrom an adherent surface 14 of the dry apply protective system 10 to anopposite application surface 12, the dry apply protective system 10includes the backing 20, the protective film 30, the release layer 40,and the application tape 50. More specifically, adherent surfaces 34,44, and 54 of the protective film 30, the release layer 40, and theapplication tape 50, respectively, are secured, in sequence, by adhesivematerials 36, 46, and 56 to an interior surface 22 of the backing 20 andto exterior surfaces 32 and 42 of the protective film 30 and the releaselayer 40.

In the depicted embodiment, the release layer 40 is completelysuperimposed over the protective film 30. The release layer 40 may beslightly smaller than the protective film 30 to enable the protectivefilm 30 to adhere to the application tape 50 after the backing 20 isremoved from the protective film 30 and from the application tape 50.Alternatively, the release layer 40 may have the same lateral dimensionsor substantially the same lateral dimensions (i.e., within acceptabletolerances, with the exception of any protruding edges or tabs thatfacilitate removal of the release layer 40 from the protective film 30,etc.) as the protective film 30. The application tape 50 may, incontrast, have at least one lateral dimension that exceeds acorresponding lateral dimension of the release layer 40 and theprotective film 30. Thus, the application tape 50 may include at leastone peripheral region 51 that extends laterally beyond correspondingfour outer edges 41 and 31 of the release layer 40 and the protectivefilm 30, respectively. In the depicted embodiment, peripheral regions 51of the application tape 50 extend laterally beyond each of the fourouter edges 41 of the release layer 40 and beyond each of the four outeredges 31 of the protective film 30. The backing 20 may have the samelateral dimensions or substantially the same lateral dimensions (i.e.,within acceptable tolerances, with the exception of any protruding edgesor tabs that facilitate removal of the release layer 40 from theprotective film 30, etc.) as the application tape 50.

In such an embodiment, the adherent surface 54, at peripheral portions50 p of the application tape 50, is exposed laterally beyond the releaselayer 40 and the protective film 30. Thus, when the elements of the dryapply protective system 10 are assembled, the adherent surface 34 of theprotective film 30 and the peripheral portions 50 p of the applicationtape 50 that are exposed laterally beyond the protective film 30 aresecured to the interior surface 22 of the backing 20. This arrangementprotects the adhesive material 36 on the adherent surface 34 of theprotective film 30 during manufacture (e.g., as installation assembliesare die cut, etc.), packaging, and storage of the dry apply protectivesystem 10.

Now, embodiments of the backing 20, the release layer 40, and theapplication tape 50 of a dry apply protective system 10 will bedescribed.

The backing 20 of a dry apply protective system 10 may comprise a thin,flexible, substantially planar element with an interior surface 22 andan opposite exterior surface 24. The exterior surface 24 is configuredto be located at the adherent surface 14 of the dry apply protectivesystem 10, while the interior surface 22 is configured to temporarilyadhere to the adherent surface 34 of the protective film 30 and toperipheral portions 50 p of the adherent surface 54 of the applicationtape 50. In a specific embodiment, the backing 20 is formed from paperor a paper-like material (e.g., a sheet formed at least partially frompolymer fibers, etc.). The interior surface 22 of the backing 20 mayhave a smoothness that enables the backing 20 to be readily removed fromthe adherent surfaces 34 and 54 of the protective film 30 and theapplication tape 50, respectively, and that minimizes any adhesivematerial 36 residue thereon as the interior surface 22 is removed fromadherent surface 34 of the protective film 30. In some embodiments, suchsmoothness may be achieved by way of a polymer coating on the interiorsurface 22 of the backing 20.

Some embodiments of a backing 20 may be rigid in comparison to theprotective film 30, yet still slightly flexible. The backing 20 may alsobe transparent, substantially transparent, or translucent enough toidentify various features of a surface to be protected. A variety ofmaterials, including, but not limited to, a biaxially-orientedpolyethylene terephthalate (BoPET) or a stretched polyester film (e.g.,that marketed by du Pont de Nemours & Co. under the MYLAR® trademark,etc.), may possess these characteristics and, thus, be used for thebacking 20.

The release layer 40 includes an adherent surface 44, which may carryadhesive material 46 and may be configured to be temporarily secured tothe exterior surface 32 of the protective film 30. The release layer 40may be configured to facilitate removal of the application tape 50 fromthe protective film 30 without pulling the protective film 30 off of thesurface to which it has been applied. The release layer 40 may alsoprevent damage to the protective film 30 as the protective film 30 issecured to the surface of a substrate. In some embodiments, includingthose where the protective film 30 comprises a transparent element forprotecting the surface of a monitor, or screen, of an electronic device,the release layer 40 may be configured to preserve the opticalproperties of the protective film 30 during application of theprotective film 30 to the surface of the monitor, or screen.

In some embodiments, the release layer 40 may have a thickness thatabsorbs and, optionally, distributes potentially damaging forces thatmay be applied to secure the protective film 30 to the surface of thesubstrate. Alternatively, or in addition, the release layer 40 may beformed from a material with a hardness that will absorb and/ordistribute forces that may be applied to secure the protective film 30to the surface of the substrate, but could otherwise damage theprotective film 30.

Although optional, when used, the release layer 40 may comprise amaterial that may facilitate a differential release between theapplication tape 50 and the protective film 30. The inclusion of arelease layer 40 may be desirable when adhesion between the applicationtape 50 and the protective film 30 is stronger than adhesion between theprotective film 30 and the surface that is to be protected.

In some embodiments, the release layer 40 may comprise a rigid, butflexible, polymeric film. The use of a material that is harder than thematerial of the protective film 30 (e.g., harder than a Shore A hardnessof about 90, etc.) may provide a desired balance of adhesion betweenadjacent layers of the dry apply protective system 10. In specificembodiments, the release layer 40 may comprise a polyester or apolypropylene. Polyester and polypropylene films are available from avariety of vendors, including, without limitation, E.I. du Pont deNemours and Co. of Wilmington, Del., and Exxon Mobil Corporation ofIrving, Tex.

The adhesive material 46, when carried by the adherent surface 44 of therelease layer 40 and secured to the exterior surface 32 of theprotective film 30, may have an adhesive strength sufficient to enablethe release layer 40 to remain in place on the exterior surface 32 ofthe protective film 30 as the application tape 50 is removed from theexterior surface 42 of the release layer 40. The adhesive strength ofthe adhesive material 46 on the adherent surface 44 of the release layer40 may also enable removal of the release layer 40 from the exteriorsurface 32 of the protective film 30 without overcoming the adhesivestrength with which the adhesive material 36 on the adherent surface 34of the protective film 30 secures the protective film 30 to a surface ofa substrate. Thus, the release layer 40 may be removed from the exteriorsurface 32 of the protective film 30 without pulling the adherentsurface 34 of the protective film 30 from the surface of the substrate.In some embodiments, one or more of the adhesive material 46, theadherent surface 44 of the release layer 40, and the exterior surface 32of the protective film 30 may be configured to enable removal of therelease layer 40 from the exterior surface 32 of the protective film 30while leaving little or no residue of adhesive material 46 on theexterior surface 32.

The application tape 50 includes an adherent surface 54, which carriesadhesive material 56 and is configured to be temporarily secured to theexterior surface 42 of the release layer 40. The application tape 50 isconfigured to facilitate alignment of the protective film 30 over asurface of a substrate and to facilitate preliminary or initial adhesionof the protective film 30 to the surface of the substrate. In thisregard, the application tape 50 may comprise a relatively thin, flexiblefilm of somewhat transparent material.

In a specific embodiment, the application tape 50 may comprise a filmavailable from entrotech, inc., under the trade designation ENTROFILM™.

The adhesive material 56 on the application tape 50, when carried by theadherent surface 54 of the application tape 50 and adhered to theexterior surface 42 of the release layer 40, may have an adhesivestrength that may enable the application tape 50 to be removed from theexterior surface 42 of the release layer 40 without overcoming theadhesive strength with which the adhesive material 46 on the adherentsurface 44 of the release layer 40 is secured to the exterior surface 32of the protective film 30. Thus, the application tape 50 may be removedfrom the exterior surface 42 of the release layer 40 without removingthe adherent surface 44 of the release layer 40 from the exteriorsurface 32 of the protective film 30. The adhesive material 56, theadherent surface 54 of the application tape 50, or the exterior surface42 of the release layer 40, the material from which the release layer 40is formed, or any combination of these features, may be configured toenable removal of the application tape 50 from the exterior surface 42of the release layer 40 while leaving little or no residue of adhesivematerial 56 on the exterior surface 42.

In a specific embodiment, an adhesive material available from entrotech,inc., under the trade name ENTROCHEM™ may be used as the adhesivematerial 56.

In some embodiments, including those where a release layer 40 remains inplace upon the exterior surface 32 of the protective film 30 when theapplication tape 50 is removed from the protective film 30, a dry applyprotective system 10 according to the present invention may also includea release tab 70. The release tab 70 may be configured to enable removalof the release layer 40 from the protective film 30. The release tab 70,which may initially be separate from the remainder of the dry applyprotective system 10, comprises a substantially planar, somewhatflexible element with an application surface 72 and an opposite,adherent surface 74. The adherent surface 74 may carry an adhesivematerial 76. In addition, a backing element 78 may be disposed over theadherent surface 74 of the release tab 70 and secured to the adherentsurface 74 with the adhesive material 76.

The adhesive material 76 may comprise a pressure-sensitive adhesive, orinclude a pressure-sensitive component, that will secure the release tab70 to the exterior surface 42 of the release layer 40 when the adherentsurface 74 of the release tab 70 is positioned against the exteriorsurface 42 of the release layer 40 and sufficient pressure is applied tothe application surface 72 of the release tab 70. As the release tab 70is configured to enable removal of the release layer 40 from theprotective film 30, one or more of the adhesive material 76, theadherent surface 74 by which the adhesive material 76 is carried, andthe exterior surface 42 of the release layer 40 may be configured toeffectively impart the adhesive material 76 with an adhesion strengththat exceeds the strength with which the adherent surface 44 of therelease layer 40 is secured to the exterior surface 32 of the protectivefilm 30. Conversely, the strength with which the adhesive material 76secures the adherent surface 74 of the release tab 70 to the exteriorsurface 42 of the release layer 40 may be insufficient to overcome thestrength with which the adhesive material 36 on the adherent surface 34of the protective film 30 secures the protective film 30 to a surface ofa substrate. Thus, the release tab 70 may enable removal of the releaselayer 40 from the protective film 30 without enabling removal of theprotective film 30 from the surface of the substrate.

As shown in FIG. 6, in which the backing 20 has been partially peeledaway from the remainder of the dry apply protective system 10, someembodiments of the release layer 40 may include indicia 47, which may bevisible from the exterior surface 42 of the release layer 40. Theindicia 47 may include one or more alignment features 48, one or moreinstructional features 49, or any other features that may facilitate orenable proper application of the protective film 30 to the surface of asubstrate. In the illustrated embodiment, the indicia 47 include both analignment feature 48 and instructional features 49 a, 49 b, 49 c, and 49d (collectively, instructional features 49). More specifically, theillustrated alignment feature 48 facilitates positioning of a bottomedge of the release layer 40 and the adjacent protective film 30 againsta bottom edge of a surface of a monitor of an electronic device to whichthe protective film 30 is to be secured, while the instructionalfeatures 49 include numbers 49 a identifying the order in which variousacts are to be carried out, or effected, as well as textual indicators49 b and 49 c and graphical indicators 49 d of the acts that are to beperformed. In some embodiments, the indicia 47 may be the same color asthe any underlying elements, which may reduce the visibility of theindicia 47 prior to use of the dry apply protective system 10 to securethe protective film 30 to the surface of a substrate.

In other embodiments, indicia 47 may be included on the application tape50 of a dry apply protective system 10.

FIG. 7 illustrates an embodiment of dry apply protective system 10′ thatlacks a release layer 40 (FIGS. 3-6). In such an embodiment, theadhesive material 56 on the adherent surface 54 of the application tape50 secures the application tape 50 directly to the exterior surface 32of the protective film 30. A backing 20 covers the adherent surface 34of the protective film 30, as well as peripheral portions 50 p of theadherent surface 54 that are located laterally beyond outer edges 31 ofthe protective film 30.

Regardless of whether a dry apply protective system 10, 10′ (or anyother embodiment of a dry apply protective system) includes a releaselayer 40 (FIG. 5A), the additional application tape 50 protects theprotective film 30 during handling, storage, shipping, and as theprotective film 30 is applied to a surface that is to be protected.

An embodiment of a method for manufacturing a dry apply protectivesystem 10 is illustrated in reference to FIGS. 8-12.

Separate rolls (not shown) of a release film 20′, a polymer film 30′, aprotective film 40′, and an application film 50′ may be provided. Eachof the polymer film 30′, the protective film 40′, and the applicationfilm 50′ may include an adherent surface 34, 44, and 54, respectively,onto which an adhesive material 36, 46, and 56, respectively, has beenapplied.

The release film 20′ and the polymer film 30′ may be formed inenvironments that are free of contaminants (e.g., dust, other particles,etc.) (e.g., in a clean room environment, such as an ISO class 5 cleanroom; in a cleaner environment, such as an ISO class 1 clean room;etc.). In other embodiments, an interior surface 22′ of the release film20′ and an adherent surface 34 (FIG. 21) of the polymer film 30′ may becleaned to remove any contaminants before an adhesive material 36 (FIGS.2 and 5A) is applied to the adherent surface 34′ (FIG. 21) and securesthe interior surface 22′ to the adherent surface 34′.

The adhesive material 36 may also be manufactured in an environment thatis free of contaminants, or it may be filtered to remove contaminants.The adhesive material 36 may then be applied to the adherent surface 34of the polymer film 30′ is a contaminant-free environment. In specificembodiments, each cubic meter of adhesive material 36 may include, onaverage, no more than 10⁵ (i.e., 100,000) contaminant particles withdimensions of larger than 0.1 μm; fewer, on average, than 30 contaminantparticles with dimensions of larger than 5 μm; on average, no more thanten (10) contaminant particles with dimensions of larger than 0.1 μm; orno more than an average of two contaminant particles with dimensionslarger than 0.2 μm; etc.

In some embodiments, one or both of the protective film 40′ and theapplication film 50′ may also be contaminant free.

Indicia 47 may be printed onto an exterior surface 42′ of the protectivefilm 40′ in a suitable manner, as shown by FIG. 8.

As illustrated by FIG. 9, the adherent surface 44′ of a protective film40′, from which the release layer 40 of the dry apply protective system10 (FIGS. 3-6) is formed, is brought into contact with, or at least inclose proximity to, an exterior surface 32′ of the polymer film 30′,from which the protective film 30 (FIG. 10) is ultimately formed. As theadherent surface 44′ and the exterior surface 32′ are brought together,the adhesive material 46 on the adherent surface 44′ secures theprotective film 40′ to the exterior surface 32′ of the polymer film 30′.

One or more protective film 30-release layer 40 laminates may then bedefined from the laminate of the polymer film 30′ and the protectivefilm 40′, as illustrated by FIG. 10. Without limitation, the polymerfilm 30′-protective film 40′ laminate may be die cut, with the resultingprotective film 30 (and release layer 40) having a desiredconfiguration; e.g., a shape that is designed to protect a surface of aparticular device.

As shown in FIG. 11, each protective film 30-release layer 40 laminatemay be disposed between an interior surface 22′ of the release film 20′and an opposed adhesive material 56-coated adherent surface 54′ of theapplication film 50′. As pressure is applied to opposite exteriorsurfaces 24′ and 52′ of the release film 20′ and the application film50′, respectively, adhesive material 56 on the adherent surface 54′ ofthe application film 50′ secures the adherent surface 54′ to theexterior surface 42 (FIG. 5A) of each release layer 40 and to portionsof the interior surface 22′ of the release film 20′ that are locatedlaterally beyond the outer edges 31 and 41 (FIG. 5) of the protectivefilm 30 and the release layer 40, respectively. Thus, each protectivefilm 30-release layer 40 laminate is captured and secured in placebetween the release film 20′ and the application film 50′.

Thereafter, as illustrated by FIG. 12, the release film 20′ and theapplication film 50′ may be cut (e.g., die cut, etc.) to respectivelydefine the backing 20 and the application tape 50 of each dry applyprotective system 10 (FIGS. 3-6).

Referring now to FIGS. 13-18, an embodiment of a method for protecting asurface 110 of a substrate 100 (e.g., an electronic device, etc.) isexplained.

In FIG. 13, the backing 20 is removed from the peripheral portions 50 p(FIG. 5) of the adherent surface 54 of the application tape 50 of a dryapply protective system 10, and from the adherent surface 34 of theprotective film 30 of the dry apply protective system 10 (FIG. 5A). Insome embodiments, as shown in FIG. 6, indicia 47 may provideinstructions on application of the protective film 30 to the surface 110(FIG. 14) of the substrate 100.

Next, as shown in FIG. 14, an outer edge 31 of the protective film 30may be aligned with a corresponding feature (e.g., an edge of a surface110, an edge of a monitor, etc.) on the surface 110 of the substrate100. With the protective film 30 properly aligned, a peripheral region51 of the application tape 50, which peripheral region 51 is locatedlaterally adjacent to the outer edge 31 of the protective film 30, maybe secured to a corresponding location (e.g., a bottom edge of thesubstrate 100, as illustrated, etc.) adjacent to the surface 110 of thesubstrate 100.

As depicted by FIGS. 15A and 15B, a pressure front 150 (e.g., a pressureof about 360 g/cm², etc.) may be established at or just outside of theouter edge 31 of the protective film 30. In the depicted embodiment, thepressure front 150 is substantially linear, although the application ofpressure fronts of other configurations (e.g., curved pressure fronts,chevron pressure fronts, pressure points, etc.) may also be used. Thepressure front 150 may have a width that is substantially the same as orexceeds a corresponding dimension of the protective film 30. Thepressure front 150 may be established by positioning an edge 210 of apressure application element 200, such as the depicted squeegee, a card,a finger or the like against the exterior surface 52 of the applicationtape 50 at the peripheral region 51. Once the pressure front 150 hasbeen established, the pressure application element 200 may be moved in adirection 160 transverse (e.g., perpendicular, substantiallyperpendicular (i.e., such that during linear movement, the pressurefront 150 will completely cross a corresponding dimension of theprotective film 30), etc.) to an orientation of the pressure front 150.The pressure applied at the pressure front 150 may be constant orsubstantially constant (i.e., sufficient to force the adhesive material36 on the adherent surface 34 of the protective film 30 against thesurface 110 of the substrate 100, etc.). Movement of the pressure front150 may be continuous or substantially continuous (i.e., varied rate ofmovement, but no stopping until the pressure front 150 has movedcompletely over the protective film 30). Such action may adhere theadherent surface 34 of the protective film 30 to the surface 110 of thesubstrate 100 while removing air gaps, or bubbles, from between acentral region 33 of the protective film 30 and the surface 110 of thesubstrate 100.

As an alternative, as depicted by FIG. 15C, an individual may use his orher finger(s) to secure the protective film 30 to the surface 110 of thesubstrate 100. Without limitation, an individual may apply pressure tothe protective film 30 through the application tape 50 (and, optionally,through the release layer 40) (FIGS. 3-5). The finger(s) may be movedover the protective film 30 to secure the protective film 30 to thesurface 110 and to remove air bubbles from between the protective film30 and the surface 110 until the protective film 30 is sufficientlysecured to the surface 110 and has a desired appearance.

With the protective film 30 at least partially secured to the surface110 of the substrate 100, the application tape 50 may be removed fromover the protective film 30, as shown in FIG. 16.

FIG. 17 illustrates an embodiment of the manner in which any air gaps,or bubbles, between the protective film 30 and the surface 110 (FIG. 16)of the substrate 100 to which the protective film 30 has been applied,may be removed from locations that are adjacent to one or more outeredges 31 of the protective film 30. In particular, one or more pressurefronts 170 a, 170 b, etc., may be applied over the protective film 30 atlocations between the central region 33 of the protective film 30 andouter edges 31 of the protective film 30. The pressure fronts 170 a, 170b, etc., may be oriented parallel to or substantially parallel tocorresponding outer edges 31 of the protective film 30, over which thepressure fronts 170 a, 170 b, etc., will move. Once established, eachpressure front 170 a, 170 b, etc., may move in a direction 180 a, 180 b,etc., that extends from an initial position over the central region ofthe protective film 30 to a terminal position over or outside of thecorresponding outer edge 31.

In some embodiments, the pressure fronts 170 a, 170 b, etc., may beapplied after the application tape 50 has been removed (FIG. 16), inwhich case they may be applied directly to and move over the exteriorsurface 32 of the protective film 30. Alternatively, the pressure fronts170 a, 170 b, etc., may be applied to the exterior surface 52 of theapplication tape 50 (FIGS. 15A and 15B) prior to its removal from theexterior surface 32 of the protective film 30.

Once all or substantially all of the air gaps, or bubbles, have beenremoved from between the protective film 30 and the surface 110 of thesubstrate 100, a release layer 40 or application tape 50, if any, on theexterior surface 32 of the protective film 30 may be removed from theexterior surface 32 of the protective film 30. In the embodiment shownin FIG. 18, removal of a release layer 40 may be effected with a releasetab 70 (see also FIG. 5). Specifically, a backing 78 (FIG. 5) may beremoved from the adherent surface 74 of the release tab 70 to expose theadhesive material 76 on the adherent surface 74. With the adhesivematerial 76 exposed, the release tab 70 may be positioned over theexterior surface 42 of the release layer 40 at or near an outer edge 41of the release layer 40, then secured to the exterior surface 42 byapplying pressure sufficient to the application surface 72 of therelease tab 70. The release tab 70 may then be grasped and pulled awayfrom the surface 110 of the substrate 100, which also overcomes thestrength with which the adhesive material 46 on the release layer 40secures the adherent surface 44 of the release layer 40 to the exteriorsurface 32 of the protective film 30. Thus, as the release tab 70 ispulled away from the surface 110 of the substrate 100, it pulls therelease layer 40 with it, removing the release layer 40 from theexterior surface 32 of the protective film 30.

An embodiment of the protected substrate 100 is shown in FIG. 19.Specifically, the substrate 100 includes a surface 110 that is coveredby a protective film 30. The protective film 30 has been secured to thesurface 110 using a dry apply process, which eliminates the need for wetadhesives that may otherwise void any warranty covering the substrate100. In the depicted embodiment, the protective film 30 substantiallycovers a surface 110 through which a monitor 114 of a portableelectronic device (i.e., the substrate 100) is visible. The transparencyof the protective film 30 and the adhesive material 36 that secures thesame to the surface 110, the lack of any contaminants within theadhesive material 36 or otherwise between the protective film 30 and thesurface 110, the absence of any imperfections in the protective film 30from the installation process, and the lack of any air voids, orbubbles, between the protective film 30 and the surface 110 may optimizethe aesthetics of the protective film 30 and enable distortion-freeviewing of the monitor 114.

In the event that, with repeated use of the substrate 100, one or moreouter edges 31 of the protective film 30 peel away from the surface 110,the protective film 30 is scratched, or the protective film 30 otherwisegains an undesirable appearance, it may be peeled from the surface 100and replaced with another protective film 30.

Other surfaces of the substrate 100 may be covered with transparent,translucent, and/or opaque protective films in a manner consistent withteachings of this disclosure.

Turning now to FIGS. 20-24, another embodiment of a dry apply protectivesystem 10′, which may simply be referred to as a “system 10′,” isillustrated Like system 10, system 10′ includes a protective film 30′, abacking 20′, a release layer 40′ and an application tape 50′. Each ofthese elements may be configured in any suitable manner.

In the depicted embodiment (see FIG. 23), the release layer 40′ and theapplication tape 50′ may have sufficient transparency to enable aconsumer to accurately align the protective film 30′ with a surface of asubstrate 100′ to which the protective film 30′ is to be secured. Insome embodiments, the backing 20′ may also be transparent orsubstantially transparent. A transparent or substantially transparentbacking 20′ may enable a consumer to confirm that the protective film30′ will provide the desired coverage without requiring removal of thebacking 20′ from either the protective film 30′ or the application tape50′.

The release layer 40′ is configured to completely cover an exteriorsurface of the protective film 30′, and may have substantially the samelateral dimensions as the protective film 30′, or be configured to besubstantially superimposed with the protective film 30′.

The backing 20′ and the application tape 50′ are both larger than theprotective film 30′. As illustrated, when assembled with the protectivefilm 30′, each peripheral edge of both the backing 20′ and theapplication tape 50′ is located laterally beyond its correspondingperipheral edge of the protective film 30′. In the illustratedembodiment, the backing 20′ and the application tape 50′ are initially(when the dry apply protective system 10′ is provided to a consumer)substantially superimposed with one another.

As FIGS. 20 and 21 show, the backing 20′ of the system 10′ may include atab 25 a′ or another feature that protrudes from the outer periphery 21′of the backing 20′. Optionally, the backing 20′ may include another tab25 b′ or other protruding feature, which may be positioned adjacent to adifferent edge of the outer periphery 21′ than the tab 25 a′ (e.g., anopposite edge of the outer periphery 21′, etc.) In some embodiments, theapplication tape 50′ may include a corresponding tab 55 a′ or otherprotruding feature that is configured to be superimposed with the tab 25a′. In such an embodiment, the tab 55 a′ may comprise a portion of theapplication tape 50′ that has not been coated with an adhesive material.The tab 25 a′ may be configured to enable grasping of a portion of thebacking 20′ and to facilitate removal of the backing 20′ from theprotective film 30′ and from the application tape 50′ (e.g., as the tab25 a′ is pulled away from the application tape 50′ or the optional tab55 a′, etc.), as depicted by FIG. 22. The tab 25 a′ or the optional tab55 a′ may include one or more indicia (e.g., a number, such as a “1” orthe series of 1's depicted in FIG. 20; etc.) that correspond to theorder in which the tab 25 a′ is to be used to remove the backing 20′from the protective film 30′ and from the application tape 50′.

The application tape 50′ may also include a tab 55 b′ or another featurethat protrudes from an outer periphery 51′ of the application tape 50′and, optionally, beyond an adjacent, superimposed portion of an outerperiphery 21′ of the backing 20′. Unlike the majority of the applicationtape 50′, the tab 55 b′ may lack a coating of adhesive material. In theillustrated embodiment, the tab 55 b′ of the application tape 50′ ispositioned at an opposite side (e.g., an opposite end, etc.) of thesystem 10′ from the tab 25 a′ of the backing 20′ Like the tab 25 a′ ofthe backing 20′, the tab 55 b′ of the application tape 50′ may beconfigured to enable an individual to grasp the application tape 50′ andto remove it (e.g., peel it away from, etc.) from the protective film30′ and from a substrate 100′ to which the protective film 30′ has beensecured. The tab 55 b′ may include one or more indicia (e.g., a number,such as a “2” or the series of 2's depicted in FIG. 20; etc.) thatcorrespond to the order in which the tab 55 b′ is to be used to removethe application tape 50′ from the protective film 30′.

In embodiments where the application tape 50′ includes two or more tabs55 a′ and 55 b′, including embodiments where the tabs 55 a′ and 55 b′protrude from opposite sides (e.g., ends, etc.) of the application tape50′, the tabs 55 a′ and 55 b′ may enable a consumer to handle theapplication tape 50′ in a manner that facilitates alignment of theprotective film 30′ with a surface 110′ of a substrate 100′ to which theprotective film 30′ is to be applied.

In FIGS. 25-28, another embodiment of a dry apply protective system 10″is depicted. For the sake of simplicity, the dry apply protective system10″ may also be referred to as a “system 10″.” As shown, the system 10″includes a protective film 30″, a backing 20″, an application tape 50″and, optionally, a release layer 40 (FIG. 5A). The characteristics,manufacture and assembly of the system 10″ and its various elements may,in some embodiments, be similar to those of the other embodiments of dryapply systems disclosed herein, and their variations.

The protective film 30″ may be configured with a shape and dimensionsthat are substantially the same as, or slightly smaller than, thecorresponding shape and dimensions of a surface over which theprotective film 30″ is configured to be positioned. In the depictedembodiment, the protective film 30″ is configured to be positioned overthe display of the tablet computer marketed by Apple, Inc., ofCupertino, Calif., as THE NEW IPAD®. Of course, protective films 30″with other configurations (e.g., for placement over other surfaces ofTHE NEW IPAD®, over surfaces of other portable electronic devices, oversurfaces of other devices, of other substrates, etc.) are also withinthe scope of this disclosure.

The protective film 30″ may comprise any suitable material. It may beflexible. It may be transparent. In a specific embodiment, theprotective film 30″ comprises polyurethane film. In some embodiments,the protective film 30″ may be about 4 mils (0.004 in.) to about 12 mils(0.012 in.) thick.

Since it is a film, the protective film 30″ includes two surfaces thatface in opposite directions: an adherent surface 34″ and an exteriorsurface 32″. The adherent surface 34″ is configured to be positionedagainst and secured to (e.g., with an adhesive material, etc.) a surfaceof a substrate (e.g., a device, etc.) that is to be protected. Since theexterior surface 32″ faces away from the adherent surface 34″, theexterior surface 32″ is also configured to face away from the surfacethat is to be protected.

The protective film 30″ may carry and, for purposes of this disclosure,be said to comprise an adhesive material 36″. Among a variety ofdifferent adhesive materials that may be used, the adhesive material 36″may comprise a so-called “pressure sensitive” adhesive material. Thepressure-sensitive adhesive material 36″ may be configured tosemi-permanently secure the adherent surface 34″ of the protective film30″ to a surface to be protected, but be selectively removed from thesurface (e.g., when repositioning the protective film 30″ relative tothe surface, when removing a damaged protective film from the surface,etc.). In addition, a pressure sensitive adhesive material 36″ may leavelittle or no residue on the previously protected surface once theprotective film 30″ has been removed from, and no longer protects, thatsurface.

In some embodiments, the adherent surface 34″ and/or any adhesivematerial 36″ thereon may include microchannels. In a specificembodiment, the microchannels may impart the adherent surface 34″ and/orany adhesive material 36″ thereon with a repetitive hexagonal pattern.The microchannels may enable air to be removed from between the adherentsurface 34″ and a surface to which the protective film 30″ is secured,while the protective film 30″ is secured to that surface and/or afterthe protective film 30″ has been secured to that surface.

The backing 20″ may be removably secured to the adherent surface 34″ ofthe protective film 30″, or to any adhesive material 36″ on the adherentsurface 34″, to prevent contamination of the adherent surface 34″ or anyadhesive material 36″ on the adherent surface 34″. The backing 20″ maybe rigid in comparison to the protective film 30″, yet still slightlyflexible. The backing 20″ may also be transparent, substantiallytransparent, or translucent enough to identify various features of asurface to be protected. A variety of materials, including, but notlimited to, a biaxially-oriented polyethylene terephthalate (BoPET) or astretched polyester film (e.g., that marketed by du Pont de Nemours &Co. under the MYLAR® trademark, etc.), may possess these characteristicsand, thus, be used for the backing 20″. Without limiting the scope ofthe disclosed subject matter, the backing 20″ may, in some embodiments,have a thickness of about 5 mils (0.005 in.) to about 10 mils (0.010in.).

One or more characteristics of the backing 20″ may facilitate itsremoval from the application tape 50″ more readily than the applicationtape 50″ is removed from the protective film 30″. Some non-limitingexamples of such characteristics include the rigidity of the backing20″, a material of the backing 20″ (or a coating thereof) thatinterfaces with the adhesive material 56″ on the adherent surface 54″ ofthe application tape 50″, and an area of the backing 20″ adhered to theapplication tape 50″.

As shown in FIG. 28, some embodiments of the backing 20″ may besegmented. As illustrated, the backing 20″ may include two or morediscrete sections, including a relatively small alignment section 22″and a larger adhesion section 24″. The alignment section 22″ is referredto as such because its removal from the adherent surface 34″ of theprotective film 30″ exposes enough of the adherent surface 34″ to enablethe protective film 30″ to be aligned with and secured in place relativeto a surface to be protected, while the majority of the adherent surface34″ remains covered and, thus, protected by the adhesion section 24″ ofthe backing 20″. As the adhesion section 24″ is removed from theadherent surface 34″, the adherent surface 34″ is secured in place over,or secured to, the surface to be protected.

In addition to being configured to cover the adherent surface 34″ of theprotective film 30″, one or more portions 20 p″ of the backing 20″ maybe configured to extend laterally beyond an outer periphery 31″ of theprotective film 30″. These portions 20 p″ may be configured to besuperimposed with corresponding portions 50 p″ of the application tape50″.

With returned reference to FIGS. 25 through 28, collectively, theapplication tape 50″ may be superimposed with and removably secured inplace to the exterior surface 32″ of the protective film 30″. Portions50 p″ of the application tape 50″ that extend laterally beyond the outerperiphery 31″ of the protective film 30″ may be superimposed with andremovably secured to corresponding portions 20 p″ of the backing 20″.

As best illustrated by FIG. 27, an adherent surface 54″, oradhesive-bearing surface, of the application tape 50″ may carry anadhesive material 56″ (e.g., a pressure sensitive adhesive material,etc.), which removably secures the application tape 50″ to theprotective film 30″ and the backing 20″. The adhesive material 56″ ofthe application tape 50″ may have lower tack and, thus, be lessadhesive, than the adhesive material 36″ of the protective film 30″. Anopposite, exterior surface 52″ of the application tape 50″ faces awayfrom the protective film 30″ and the backing 20″.

The exterior surface 52″ of the application tape 50″ may be configuredto receive a pressure front 60″ (FIGS. 29 through 33), such as thatapplied by a securing element 62″ (FIGS. 29 through 33). Uponapplication of a pressure front 60″ to the exterior surface 52″ of theapplication tape 50″, the application tape 50″ may translate thepressure front 60″ to the adjacent protective film 30″ and, in someembodiments, prevent damage to the protective film 30″ as the pressurefront 60″ is indirectly applied thereto. In various embodiments, theapplication tape 50″ may be relatively flexible.

In addition, a configuration of the exterior surface 52″ of theapplication tape 50″ may minimize friction as a securing element 62″ istranslated across the exterior surface 52″. In a specific embodiment,the exterior surface 52″ may be textured in a manner that enables thesmooth, continuous translation of a securing element 62″ thereacrosswhile the securing element 62″ is used to apply a significant enoughpressure front 60″ to secure the protective film 30″ to a surface thatis to be protected.

In some embodiments, the application tape 50″ may carry indicia 58″,59″. The indicia 58″, 59″ may be carried by the exterior surface 52″, bythe adherent surface 54″, internally (e.g., between sublayers of theapplication tape 50″, etc.), or in any combination of the foregoing. Atleast some of the indicia 58″ may comprise alignment features, whichfacilitate alignment of the protective film 30″ with a surface of asubstrate to which the protective film 30″ is to be applied. Some of theindicia 59″ may comprise instructions, which may be viewed by anindividual as he or she installs the protective film 30″ on a surface tobe protected. An application tape 50″ may also carry both alignmentfeatures (indicia 58″) and instructions (indicia 59″); for example, inthe manner illustrated by FIGS. 25 and 26.

As illustrated by FIG. 29, the protective film 30″ of a system 10″, aswell as one or both of a backing 20″ and an application tape 50″ of thesystem 10″, may include a number of cutout features. Some of thesecutout features may extend through an interior portion of the protectivefilm 30″, the backing 20″ and/or the application tape 50″, while othercutout features may comprise cutouts in the periphery 31″ of theprotective film 30″ and/or the peripheries 21″ and 51″ of one or both ofthe backing 20″ and the application tape 50″, respectively.

With reference to FIGS. 29 through 33, an embodiment of a technique forprotecting the surface 110″ of a substrate 100″ is described.

In various embodiments, such a method may include removing the alignmentsection 22″ of a backing 20″ from an adherent surface 34″ of aprotective film 30″ and aligning the protective film 30″ with a surface110″ to be protected, as shown in FIG. 33. Removal of the alignmentsection 22″ of the backing 20″ from the adherent surface 34″ of theprotective film 30″ may comprise peeling the alignment section 22″ ofthe backing 20″ from the adherent surface 34″ of the protective film30″. In embodiments where the backing 20″ is relatively rigid, thealignment section 22″ may be removed by bending the protective film 30″away from the backing 20″ at or near a boundary between the alignmentsection 22″ and the adhesion section 24″ of the backing 20″, which maycause the alignment section 22″ to separate from the adherent surface34″ of the protective film 30″. An individual may then grasp the portionof the alignment section 22″ that has separated from the adherentsurface 34″ of the protective film 30″, and peel the remainder of thealignment section 22″ of the backing 20″ from the adherent surface 34″of the protective film 30″. This action exposes a relatively small area34A″ of the adherent surface 34″, which, in some embodiments, maycomprise a thin (e.g., an inch or less, three quarters of an inch orless, half an inch or less, a quarter of an inch or less, etc.),elongate strip at an edge of the protective film 30″. At this point, theadhesion section 24″ of the backing 20″ may continue to cover a majority34B″ of the adherent surface 34″.

As illustrated by FIG. 30, with the area 32A″ of the adherent surface34″ of the protective film 30″ exposed, the protective film 30″ may bealigned with the surface 110″ of the substrate 100″. Alignment of theprotective film 30″ with the surface 110″ may be facilitated by indicia58″, 59″ on an application tape 50″ carried by an exterior surface 32″of the protective film 30″ and/or by various features 38″ (e.g.,cutouts, etc.) formed through the protective film 30″ or at its outerperiphery 31″.

With the protective film 30″ held in alignment with the surface 110″ ofthe substrate 100″, or at least while attempting to maintain alignmentof the protective film 30″ and the surface 110″, the protective film 30″may be partially secured to a portion of the surface 110″. Morespecifically, adhesive material on a relatively small exposed area 34A″of the adherent surface 34″ may secure the protective film 30″ to thesurface 110″. If necessary or desired, the protective film 30″ may beremoved from, repositioned over and re-secured to the surface 110″. Inthe illustrated embodiment, where the exposed area 34A″ comprises a thinstrip, the exposed area 34A″ may be further secured to the surface 110″manually (e.g., with a finger, thumb, securing element 62″ (FIGS. 31 and32), etc.). A pressure front 60″ (FIGS. 31 and 32) may then be appliedover an area 30A″ of the protective film 30″ that has been secured tothe surface 110″ and drawn across the area 30A″ to further secure theprotective film 30″ to the surface 110″ and, optionally, to remove airbubbles from between the protective film 30″ and the surface 110″. Inembodiments where an application tape 50″ covers an exterior surface 32″of the protective film 30″, the pressure front 60″ may be applied to andtranslated across an exterior surface 52″ of the application tape 50″,which may be configured to facilitate translation of the pressure front60″ in a smooth, continuous fashion, as well as to prevent damage to theexterior surface 32″ of the protective film 30″ as it is applied andsecured to the surface 110″ of the substrate 100″.

Thereafter, as depicted by FIG. 31, once area 30A″ of the protectivefilm 30″ has been secured to the surface 110″ of the substrate 100″, theremainder 30B″ of the protective film 30″ may be lifted away from thesurface 110″. At this point, the adhesion section 24″ of the backing 20″still covers part 22B″ of the adherent surface 34″ of the remainder 30B″of the protective film 30″. With the remainder 30B″ of the protectivefilm 30″ lifted away from the surface 110″ of the substrate 100″, apressure front 60″ may be applied to the adhered area 30A″ of theprotective film 30″, and translated toward the remainder 30B″ of theprotective film 30″.

As the pressure front 60″ moves onto the remainder 30B″ of theprotective film 30″, it causes the adhesion section 24″ of the backing20″ to gradually separate from the remainder 30B″ of the protective film30″. A leading edge of the adhesion section 24″ of the backing 20″ maybe oriented away from, or in front of, the pressure front 60″ and movewith the pressure front 60″. Once the leading edge of the adhesionsection 24″ starts to extend away from the pressure front 60″, due toits rigidity, the backing 20″ may hold the unsecured portion of theremainder 30B″ of the protective film 30″ away from the surface 110″, ororient the protective film 30″ at a nonparallel angle to the surface110″. Thus, the unsecured portion of the remainder 30B″ of theprotective film 30″ may be released, and translation of the pressurefront 60″ may continue without anything other than the adhesion section24″ of the backing 30″ holding the unsecured portion of the remainder30B″ of the protective film 30″ away from the surface 110″ to beprotected. In addition, the rigidity of the backing 20″ may enable itsadhesion section 24″ to separate from the adherent surface 34″ of theprotective film 30″ without needing to be pulled or peeled from theprotective film 30″. The adhesion section 24″ of the backing 20″ mayremain somewhat flat (e.g., includes a slight bend over the pressurefront 60″, is bent at an obtuse angle, etc.), particularly when comparedwith the protective film 30″, which may be concurrently bent at an acuteangle. As the pressure front 60″ is translated over the remainder 30B″of the protective film 30″, the protective film 30″ is gradually exposedand simultaneously or immediately thereafter secured to the surface 110″of the substrate 100″, as illustrated by FIG. 32.

When the entire protective film 30″ has been secured to the surface 110″of the substrate 100″, the adhesion section 24″ of the backing 20″ mayfall away from the protective film 30″. Thereafter, any air bubbles thatmay have been trapped between the protective film 30″ and the protectedsurface 110″ of the substrate 100″ may be removed (e.g., by generationand translation of additional pressure fronts, etc.).

In embodiments where an application tape 50″ covers an exterior surface32″ of the protective film 30″, once the protective film 30″ has beensecured to the surface 110″ of the substrate 100″, the application tape50″ may removed from (e.g., peeled away from, etc.) the exterior surface32″ of the protective film 30″. In embodiments where the adhesivematerial 56″ (FIG. 27) of the application tape 50″ has lower tack thanthe adhesive material 36″ (FIG. 27) of the protective film 30″, theapplication tape 50″ may be removed from the exterior surface 32″ of theprotective film 30″ without pulling the adherent surface 34″ of theprotective film 30″ from the surface 110″.

The construction of a system 10, 10′, 10″ that incorporates teachings ofthis disclosure, as well as methods by which the protective film 30,30′, 30″ of such a system 10, 10′, 10″ may be applied to a surface of asubstrate, enable the use of dry apply techniques to provide transparentprotection over the high resolution displays of a variety of electronicdevices, including the relatively large displays of tablet and laptopcomputers.

Although the foregoing description contains many specifics, these shouldnot be construed as limiting the scope of any of the appended claims,but merely as providing information pertinent to some specificembodiments that may fall within the scopes of the appended claims.Features from different embodiments may be employed in combination. Inaddition, other embodiments may also be devised which lie within thescopes of the appended claims. The scope of each claim is indicated andlimited only by its terms and the legal equivalents to the elementsthereof. All additions, deletions and modifications to the disclosedsubject matter that fall within the meanings and scopes of the claimsare to be embraced by the claims.

What is claimed:
 1. A method for protecting a surface of a substrate,comprising: separating a backing tab that juts out from an edge of abacking beneath a bottom surface of a protective film of a system forprotecting a surface of a substrate from an application tape tab thatjuts outs from an edge of an application tape over a top surface of theprotective film; and peeling at least a portion of the backing frombeneath the bottom surface of the protective film to expose an adhesive.2. The method of claim 1, wherein the separating comprises grasping thebacking tab.
 3. The method of claim 2, wherein the separating furthercomprises grasping the application tape tab.
 4. The method of claim 1,wherein the peeling at least a portion of the backing comprises pullingthe backing tab over and away from at least a portion of the protectivefilm to expose the adhesive.
 5. The method of claim 1, wherein: thepeeling at least a portion of the backing comprises peeling a portion ofthe backing continuous with the backing tab to expose a portion of theadhesive adjacent to a first peripheral edge of the protective filmwithout removing a remainder of the backing from a remainder of theadhesive.
 6. The method of claim 5, further comprising: securing theportion of the adhesive to the surface of the substrate.
 7. The methodof claim 6, further comprising: peeling the remainder of the backingaway from the remainder of the adhesive; and securing the remainder ofthe adhesive to the surface of the substrate.
 8. The method of claim 7,wherein the peeling the remainder of the backing away from the remainderof the adhesive and the securing the remainder of the adhesive to thesurface of the substrate comprise: lifting an unsecured portion of theprotective film away from the surface of the substrate; applying apressure front to a secured portion of the protective film that has beenadhesively secured to the surface of the substrate; translating thepressure front from the secured portion to the unsecured portion of theprotective film; releasing the protective film, the remainder of thebacking holding the unsecured portion of the protective film away fromthe surface of the substrate; and further translating the pressure frontacross the protective film to concurrently progressively release anothersection of the backing from the unsecured portion of the protective filmand progressively secure the unsecured portion of the protective film tothe surface of the substrate.
 9. The method of claim 8, wherein: thetranslating the pressure front from the secured portion to the unsecuredportion of the protective film comprises separating a portion of theremainder of the backing located adjacent to the portion of the adhesivefrom the remainder of the adhesive; the releasing the protective filmcomprises positioning an edge of the portion of the remainder of thebacking against the surface of the substrate, with the remainder of thebacking holding the unsecured portion of the protective film in an atleast partially upright orientation; and the unsecured portion of theprotective film diminishes in size and remains at least partiallyupright while further translating the pressure front across theprotective film.
 10. The method of claim 8, wherein the applying thepressure front, the translating the pressure front, and the furthertranslating the pressure front respectively comprise applying thepressure front, translating the pressure front, and further translatingthe pressure front through the application tape over the top surface ofthe protective film.
 11. The method of claim 1, further comprising:aligning the protective film with the surface of the substrate beforesecuring the adhesive to the surface of the substrate.
 12. The method ofclaim 11, wherein the aligning includes viewing the surface of thesubstrate through the protective film and through the backing.
 13. Themethod of claim 11, wherein the aligning the protective film with thesurface of the substrate comprises grasping the application tape tab andanother application tape tab jutting out from opposite ends of theapplication tape and positioning the application tape and the protectivefilm over the surface of the substrate.
 14. The method of claim 1,further comprising: securing the adhesive to the surface of thesubstrate.
 15. The method of claim 14, wherein separating the backingtab of the system for protecting the surface of the substrate from theapplication tape tab of the system for protecting the surface of thesubstrate comprises grasping a first application tape tab that juts outfrom a first peripheral edge of the system for protecting the surface ofthe substrate.
 16. The method of claim 15, further comprising: graspingthe first application tape tab or a second application tape tab aftersecuring the adhesive to the surface of the substrate.
 17. The method ofclaim 16, wherein grasping the first application tape tab or the secondapplication tape tab after securing the adhesive to the surface of thesubstrate comprises grasping the second application tape tab that jutsout from a second peripheral edge of the system for protecting thesurface of the substrate, different from the first application tape tabthat juts out from the first peripheral edge of the system.
 18. Themethod of claim 16, wherein the grasping the first application tape tabor the second application tape tab after securing the adhesive to thesurface of the substrate comprises grasping the first application tapetab.
 19. The method of claim 16, further comprising: pulling the firstapplication tape tab or the second application tape tab from an outersurface of the protective film.